• DocumentCode
    1078734
  • Title

    Low 1/f noise design of Hi-CMOS devices

  • Author

    Aoki, Masaaki ; Sakai, Yoshio ; Masuhara, Toshiaki

  • Author_Institution
    Hitachi Ltd., Tokyo, Japan
  • Volume
    29
  • Issue
    2
  • fYear
    1982
  • fDate
    2/1/1982 12:00:00 AM
  • Firstpage
    296
  • Lastpage
    299
  • Abstract
    Low-frequency noise characteristics of High-Performance CMOS(Hi-CMOS) devices were measured. It was found that the equivalent input noise power SVg,eqfor n-channel MOSFET´s has a 1/fα spectrum (0.8 < α < 0.95) above 10 µA, even for sealed-down devices with channel lengths LGof 2 µm. The SVg,eqis clearly proportional to 1/Leffdown to 0.8 µm. The noise characteristics of p-channel and n-channel MOSFET´s were compared. It was found that in Hi-CMOS devices, noise reduction in normally-off-type p-channel devices was obtained by light boron-ion implantations at doses below 1012cm-2. The 1/f noise level of p-channel devices was reduced to 1/10- 1/20 that of n-channel devices. In n-channel devices, the low-frequency noise power is a slow increasing function of the drain current. In p-channel devices, on the other hand, a threshold current was observed at which the noise begins to increase rapidly. The results are discussed in this paper in relation to the theoretical model of 1/f noise. The device design for reducing 1/f noise in CMOS differential amplifiers is also examined.
  • Keywords
    Battery charge measurement; Circuit testing; Electron traps; Fluctuations; Frequency; Low-frequency noise; MOSFET circuits; Steady-state; Tin; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1982.20699
  • Filename
    1482196