DocumentCode
1078734
Title
Low 1/f noise design of Hi-CMOS devices
Author
Aoki, Masaaki ; Sakai, Yoshio ; Masuhara, Toshiaki
Author_Institution
Hitachi Ltd., Tokyo, Japan
Volume
29
Issue
2
fYear
1982
fDate
2/1/1982 12:00:00 AM
Firstpage
296
Lastpage
299
Abstract
Low-frequency noise characteristics of High-Performance CMOS(Hi-CMOS) devices were measured. It was found that the equivalent input noise power SVg,eq for n-channel MOSFET´s has a 1/fα spectrum (0.8 < α < 0.95) above 10 µA, even for sealed-down devices with channel lengths LG of 2 µm. The SVg,eq is clearly proportional to 1/Leff down to 0.8 µm. The noise characteristics of p-channel and n-channel MOSFET´s were compared. It was found that in Hi-CMOS devices, noise reduction in normally-off-type p-channel devices was obtained by light boron-ion implantations at doses below 1012cm-2. The 1/f noise level of p-channel devices was reduced to 1/10- 1/20 that of n-channel devices. In n-channel devices, the low-frequency noise power is a slow increasing function of the drain current. In p-channel devices, on the other hand, a threshold current was observed at which the noise begins to increase rapidly. The results are discussed in this paper in relation to the theoretical model of 1/f noise. The device design for reducing 1/f noise in CMOS differential amplifiers is also examined.
Keywords
Battery charge measurement; Circuit testing; Electron traps; Fluctuations; Frequency; Low-frequency noise; MOSFET circuits; Steady-state; Tin; Tunneling;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1982.20699
Filename
1482196
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