Title :
High-performance 2-GHz CMOS LC VCO with high-Q embedded inductors using wiring metal layer in a package
Author :
Yoon, Sang-Woong ; Pinel, Stephan ; Laskar, Joy
Author_Institution :
RF Micro Devices, Boston Design Center, Billerica, MA
Abstract :
This paper focuses on high-performance LC CMOS voltage-controlled oscillator (VCO) design at 2 GHz with high-Q inductors realized using wiring metal lines in advanced packages. Those inductors are used in the resonator of the VCO to achieve low phase noise, low power consumption, and a wide frequency tuning range. A fine-pitch ball-grid array (FBGA) package and a wafer-level package (WLP) are incorporated to realize the high-Q inductor. The Q-factors of inductors embedded in packages are compared with a Si on-chip inductor. The effects of the high Q-factor on the VCO performance are investigated. In addition, the dominant loss factor in an LC-tank is analyzed from the phase noise perspective. The VCOs using three different inductor technologies are presented. The performance of VCOs using the embedded inductor in a FBGA and a WLP is compared with that of a VCO using the on-chip inductor. The VCO design is optimized from the high-Q perspective to enhance performance. Through this optimization, less phase noise, lower power consumption, and a wider frequency tuning range are obtained simultaneously
Keywords :
CMOS integrated circuits; MMIC oscillators; ball grid arrays; circuit tuning; g-factor; inductors; low-power electronics; phase noise; silicon; voltage-controlled oscillators; 2 GHz; CMOS LC VCO; FBGA package; LC tank; Q-factors; WLP; advanced packages; dominant loss factor; fine-pitch ball-grid array; frequency tuning; high-Q embedded inductors; on-chip inductor; phase noise; power consumption; wafer-level package; wiring metal layer; Energy consumption; Frequency; Inductors; Packaging; Phase noise; Q factor; Tuning; Voltage-controlled oscillators; Wafer scale integration; Wiring; CMOS voltage-controlled oscillator (VCO); embedded inductor; fine-pitch ball-grid array (FBGA) package; high-Q inductor; wafer-level package (WLP);
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.875404