Epitaxial-Side Mounting of Terahertz Quantum- Cascade Lasers for Improved Heat Management

Author

Kruger, Olaf ; Kreutzmann, Sabrina ; Prasai, Deepak ; Wienold, M. ; Sharma, Ritu ; Pittroff, Wolfgang ; Weixelbaum, Leonhard ; John, Wolfgang ; Biermann, Klaus ; Schrottke, L. ; Schnieder, Frank ; Erbert, Gotz ; Grahn, H.T. ; Trankle, Gunther

Author_Institution

Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, Berlin, Germany

Volume

25

Issue

16

fYear

2013

fDate

Aug.15, 2013

Firstpage

1570

Lastpage

1573

Abstract

First results on epitaxial-side (epi-down) mounting of terahertz quantum-cascade lasers (QCLs) on sapphire submounts using indium solder are presented. The single-plasmon ridge waveguide lasers emit in the range 3.1–3.3 THz. An epi-down mounting scheme for stressless assembly is realized, which provides enhanced heat dissipation at the corresponding operating temperature and high stability against thermal cycling. The thermal conductance of the devices is improved by 30%, and the maximum continuous-wave operating temperature is increased by 10 K for epi-down mounted lasers achieving output power levels ${>}{\\rm 3}~{\\rm mW}$ at 55 K.

Keywords

Flip chip; quantum-cascade lasers; semiconductor device packaging; terahertz (THz); thermal management;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2013.2271323

Filename

6547692