DocumentCode :
1086617
Title :
Characterization of Parasitics in TO-Packaged High-Speed Laser Modules
Author :
Chen, Cheng ; Zhu, Ning Hua ; Zhang, Shang Jian ; Liu, Yu
Author_Institution :
Inst. of Semicond., Acad. Sinica, Beijing
Volume :
30
Issue :
1
fYear :
2007
Firstpage :
97
Lastpage :
103
Abstract :
An elaborate analysis of the parasitic network of high-speed through-hole packaging (TO)-type laser modules is presented using a small-signal equivalent circuit model. The intrinsic laser diode is obtained using the optical modulation technique, and is embedded into the model as a separate component. Three step-by-step measurements are made for determining the packaging parasitic network, including the test fixture, TO header, submount, bonding wire, and parasitics of the laser chip. A good agreement between simulated and measured results confirms the validation and accuracy of the characterization procedures. Furthermore, several key parasitic elements are found based on the simulation of the high-frequency responses of the packaged devices. It is expected that the 3-dB bandwidth of 12 GHz or more of the low-cost TO packaged laser module may be achieved using the proposed optimization method
Keywords :
equivalent circuits; optical modulation; semiconductor device packaging; semiconductor lasers; 12 GHz; equivalent circuit model; high-speed laser modules; intrinsic laser diode; laser chip; microwave packaging; optical modulation; packaging parasitic network; semiconductor laser; three step-by-step measurements; through-hole packaging; Bonding; Circuit testing; Diode lasers; Equivalent circuits; Fixtures; Laser modes; Optical modulation; Packaging; Semiconductor device measurement; Wire; Equivalent circuits; intrinsic laser; microwave packaging; semiconductor laser; through hole (TO) packaging;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2006.884779
Filename :
4084584
Link To Document :
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