Title :
Silicon Bench for Passive Coupling and Packaging of High-Frequency Optoelectronic Devices
Author :
Yang, H. ; Zhu, H.L. ; Xie, H.Y. ; Zhao, L.J. ; Zhou, F. ; Wang, W.
Author_Institution :
Inst. of Semicond., Acad. Sinica, Beijing
Abstract :
Coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. Here, we report the design and successful fabrication of a silicon bench that integrates a V-groove and high-frequency coplanar waveguide (CPW) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution
Keywords :
coplanar waveguides; integrated optoelectronics; semiconductor device packaging; silicon; CPW; Si; V-groove; high-frequency coplanar waveguide; high-frequency optoelectronic devices; high-resistivity silicon wafer; optoelectronic packaging; passive coupling; silicon bench; Coplanar waveguides; Costs; Coupling circuits; Electromagnetic heating; Microwave devices; Optical device fabrication; Optical waveguides; Optoelectronic devices; Packaging; Silicon; Coplanar waveguide (CPW); V-groove; high-frequency; low microwave loss; optoelectronic packaging; passive coupling; silicon bench;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2006.890214
