DocumentCode :
1089373
Title :
Zone-melting recrystallization of polycrystalline silicon films on fused silica substrates using RF-Heated carbon susceptor
Author :
Kobayashi, Y. ; Fukami, A. ; Suzuki, Takumi ; Suzuki, T.
Author_Institution :
Hitachi, Limited, Hitachi, Ibaraki, Japan
Volume :
4
Issue :
5
fYear :
1983
fDate :
5/1/1983 12:00:00 AM
Firstpage :
132
Lastpage :
134
Abstract :
High-quality recrystallized silicon films on fused silica substrates have been produced with a new micro-zone-melting method using an RF-heated carbon susceptor. In this method, the fused silica substrate, on which a 0.5-1.0-µm-thick polycrystalline silicon film encapsulated with a 1.2-µm-thick CVD-SiO2layer has been deposited, is moved across the carbon susceptor surface, which has a narrow-strip high-temperature zone. Recrystallized silicon films with
Keywords :
Crystallization; Electron mobility; Liquid crystal displays; Optical films; Semiconductor films; Silicon compounds; Strips; Substrates; Surface texture; Temperature measurement;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1983.25677
Filename :
1483421
Link To Document :
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