• DocumentCode
    1090335
  • Title

    p-Channel MOSFET´s in LPCVD PolySilicon

  • Author

    Malhi, S.D.S. ; Chatterjee, P.K. ; Pinizzotto, R.F. ; Lam, H.W. ; Chen, C.E.C. ; Shichijo, H. ; Shah, R.R. ; Bellavance, D.W.

  • Author_Institution
    Texas Instruments Incorporated, Dallas, TX
  • Volume
    4
  • Issue
    10
  • fYear
    1983
  • fDate
    10/1/1983 12:00:00 AM
  • Firstpage
    369
  • Lastpage
    371
  • Abstract
    p-channel MOSFET´s have been fabricated in LPCVD polysilicon. A 5000-Å n+poly acts as the gate electrode on which a 500-Å thermal oxide is grown to act as the gate insulator. Then a 1500-Å LPCVD polysilicon layer is deposited at 620°C and is subsequently boron doped to form the conductive channel. Devices with channel length as small as 2 µm show well-behaved transistor characteristics. The drive current and leakage current are as suitable for usage as load element in memory applications. At large gate voltages the accumulation hole mobility is 9 cm2/V.s. The drain-to-source breakdown voltage exceeds -20 V.
  • Keywords
    Boron; CMOS technology; Electrodes; Insulation; Leakage current; MOSFETs; Resistors; Silicon; Testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1983.25767
  • Filename
    1483511