مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

1091901

Title :

Special issue on Packaging Reliability

Volume :

Issue :

fYear :

2008

fDate :

3/1/2008 12:00:00 AM

Firstpage :

236

Lastpage :

236

Abstract :

Provides notice of upcoming special issue(s) of interest to practitioners and researchers.

fLanguage :

English

Journal_Title :

Device and Materials Reliability, IEEE Transactions on

Publisher :

ieee

ISSN :

1530-4388

Type :

jour

DOI :

10.1109/TDMR.2008.919753

Filename :

4463816

Link To Document :