• DocumentCode
    1094845
  • Title

    Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy

  • Author

    Shih, C.J. ; Liu, G.C.

  • Author_Institution
    Dept. of Mech. & Electromech. Eng., Tamkang Univ., Tamsui, Taiwan
  • Volume
    27
  • Issue
    3
  • fYear
    2004
  • Firstpage
    551
  • Lastpage
    559
  • Abstract
    This paper presents a formal systematic optimization process to plate-fins heat sink design for dissipating the maximum heat generation from electronic component by applying the entropy generation rate to obtain the highest heat transfer efficiency. The design investigations demonstrate the thermal performance with horizontal inlet cooling stream is slightly superior to that with vertical inlet cooling stream. However, the design of vertical inlet stream model can yield to a less structural mass (volume) required than that of horizontal inlet stream model under the same amount of heat dissipation. In this paper, the constrained optimization of plate-fins heat sink design with vertical inlet stream model is developed to achieve enhanced thermal performance. The number of fins and the aspect ratio are the most responsive factors for influencing thermal performances. The heat sink used on AMD Thunderbird 1-GHz processor has been examined and redesigned by presenting optimization methodology. The optimal thermal analysis has a very good agreement to the both of vendors´ announced information and using simulation of parabolic hyperbolic or elliptic numerical integration code series (PHOENICS). The optimum design that minimizes entropy generation rate in this paper primarily applied three criteria for plate-fins heat sink optimal design: formal constrained nonlinear programming to obtain the maximum heat dissipation; prescribed heat dissipation; prescribed surface temperature. As a result, the thermal performance can be notably improved; both the sink size and structural mass can apparently be reduced through the presented design method and process. This analysis and design methodology can be further applied to other finned type heat sink designs.
  • Keywords
    cooling; design engineering; entropy; heat sinks; thermal analysis; thermal management (packaging); AMD Thunderbird; aspect ratio; constrained optimization; electronic component; electronic cooling; engineering design; entropy generation rate; entropy generation strategy; finned type heat sink; formal constrained nonlinear programming; formal systematic optimization process; heat dissipation; heat transfer efficiency; horizontal inlet cooling stream; optimal design methodology; optimal thermal analysis; parabolic hyperbolic or elliptic numerical integration code series; plate-fins heat sinks; structural mass; surface temperature; thermal performance enhancement; vertical inlet cooling stream; Constraint optimization; Design methodology; Design optimization; Electronic components; Electronics cooling; Entropy; Heat sinks; Heat transfer; Optimization methods; Thermal factors; Engineering design; entropy generation rate; heat transfer; optimal design; plate-fin heat sink;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.831812
  • Filename
    1331552