مرکز منطقه ای اطلاع رساني علوم و فناوري - IIB-3 aluminum alloys with titanium, tungsten, and copper for multilayer interconnections

DocumentCode :

1095084

Title :

IIB-3 aluminum alloys with titanium, tungsten, and copper for multilayer interconnections

Author :

Gardner, D. ; Michalka, Tim ; Saraswat, Krishna ; McVittie, J. ; Barbee, T. ; Meindl, J.

Volume :

Issue :

fYear :

1984

fDate :

12/1/1984 12:00:00 AM

Firstpage :

1965

Lastpage :

1965

Keywords :

Aluminum alloys; Annealing; Conductivity; Copper; Electromigration; Nonhomogeneous media; Rough surfaces; Surface roughness; Titanium; Tungsten;

fLanguage :

English

Journal_Title :

Electron Devices, IEEE Transactions on

Publisher :

ieee

ISSN :

0018-9383

Type :

jour

DOI :

10.1109/T-ED.1984.21835

Filename :

1484120

Link To Document :