DocumentCode :
109657
Title :
Fabrication of a Silicon Backshort Assembly for Waveguide-Coupled Superconducting Detectors
Author :
Crowe, E.J. ; Bennett, C.L. ; Chuss, David T. ; Denis, Kevin L. ; Eimer, Joseph ; Lourie, N. ; Marriage, Tobias ; Moseley, Samuel H. ; Rostem, Karwan ; Stevenson, T.R. ; Towner, Deborah ; U-Yen, K. ; Wollack, E.J.
Author_Institution :
NASA Goddard Space Flight Center, Greenbelt, MD, USA
Volume :
23
Issue :
3
fYear :
2013
fDate :
Jun-13
Firstpage :
2500505
Lastpage :
2500505
Abstract :
The Cosmology Large Angular Scale Surveyor (CLASS) is a ground-based instrument that will measure the polarization of the cosmic microwave background to search for evidence for gravitational waves from a posited epoch of inflation early in the Universe´s history. This measurement will require integration of superconducting transition-edge sensors with microwave waveguide inputs with excellent control of systematic errors, such as unwanted coupling to stray signals at frequencies outside of a precisely defined microwave band. To address these needs, we present work on the fabrication of micromachined silicon, producing conductive quarter-wave backshort assemblies for the CLASS 40 GHz focal plane. Each 40 GHz backshort assembly consists of three degeneratively doped silicon wafers. Two spacer wafers are micromachined with through-wafer vias to provide a 2.04-mm-long square waveguide delay section. The third wafer terminates the waveguide delay in a short. The three wafers are bonded at the wafer level by Au-Au thermal compression bonding then aligned and flip chip bonded to the CLASS detector at the chip level. The micromachining techniques used have been optimized to create high aspect ratio waveguides, silicon pillars, and relief trenches with the goal of providing improved out of band signal rejection. We will discuss the fabrication of integrated CLASS superconducting detector chips with the quarter-wave backshort assemblies.
Keywords :
elemental semiconductors; micromachining; silicon; superconducting microwave devices; three-dimensional integrated circuits; wafer bonding; Au-Au thermal compression bonding; Cosmology Large Angular Scale Surveyor focal plane; Si; aligned bonding; chip level; conductive quarter-wave backshort assemblies; cosmic microwave background polarization; degeneratively doped silicon wafers; flip chip bonding; frequency 40 GHz; gravitational waves; ground-based instrument; high aspect ratio waveguides; improved out of band signal rejection; inflation epoch; integrated Cosmology Large Angular Scale Surveyor superconducting detector chip fabrication; micromachined silicon fabrication; micromachining techniques; microwave band; microwave waveguide inputs; relief trenches; silicon backshort assembly fabrication; silicon pillars; size 2.04 mm; spacer wafers; square waveguide delay section; stray signals; superconducting transition-edge sensor integration; systematic error control; through-wafer vias; wafer level; waveguide-coupled superconducting detectors; Assembly; Detectors; Fabrication; Gold; Microwave theory and techniques; Niobium; Silicon; Deep reactive ion etching; superconducting microstrip; surface roughness; transition edge sensors; wafer bonding;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2012.2237211
Filename :
6399541
Link To Document :
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