Title :
On the Homogenization of Multilayered Interconnect for Interfacial Fracture Analysis
Author :
Chiu, Tz-Cheng ; Lin, Huang-Chun
Author_Institution :
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan
fDate :
6/1/2008 12:00:00 AM
Abstract :
The interface crack problem for Cu/low-k interconnect is considered using global-and-local finite element analysis. In the global analysis the thin film interconnect is represented by a homogenized layer with equivalent material properties. Local model around the interface crack tip is analyzed with displacement boundary condition extracted from the global modeling result to determine the fracture mechanics parameters. It is shown that, for the global-and-local modeling approach, interconnect homogenization using representative volume element (RVE) approach provides accurate prediction on the fracture mechanics parameters for an interface crack under either thermal or mechanical loads, while significant error occurs when the interconnect, even though having thickness less than 1/100 of the whole component thickness, is neglected in the global analysis. The problem of an interface crack between low-k dielectric and etch-stop thin film in a flip-chip package under thermal excursion is also investigated as an application example of the global-and-local modeling approach.
Keywords :
finite element analysis; flip-chip devices; fracture mechanics; integrated circuit interconnections; integrated circuit packaging; low-k dielectric thin films; thermal stress cracking; Cu/low-k interconnect; displacement boundary condition; etch-stop thin film; finite element analysis; flip-chip package; fracture mechanics parameters; global-and-local modeling approach; interface crack problem; interface crack tip; interfacial fracture analysis; multilayered interconnect homogenization; representative volume element approach; thermal excursion; thin film interconnect; Cu/low-$k$ interconnect; global-and-local modeling; homogenization; interface fracture; representative volume element (RVE);
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2008.916839