Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing

Author

Ash, W.M. ; Meredith, W.F. ; Banks, C.A. ; Neskovski, N.N. ; Wolff, B. ; Monroe, K. ; Casasnovas, A.

Author_Institution

Belcan Eng., Tempe, AZ, USA

Volume

4

Issue

12

fYear

2014

fDate

Dec. 2014

Firstpage

1989

Lastpage

1998

Abstract

Rigorous environmental testing, with C-mode scanning acoustic microscopy (CSAM) inspection, was imposed on a sizeable set of exemplary commercial off-the-shelf plastic encapsulated microcircuits (PEMs) to demonstrate their suitability for dormant storage over extensive periods of time. After qualification testing of over 4800 samples of 39 standard manufacturer (mfr) part numbers from 18 world-class mfrs in 25 widely different PEM package types, indications of product discrepancies by CSAM were largely discounted based upon device reliability testing, including physical cross sectioning.

Keywords

acoustic microscopy; environmental testing; integrated circuit packaging; integrated circuit reliability; integrated circuits; C-mode scanning acoustic microscopy; CSAM; PEM; device reliability testing; environmental testing; off-the-shelf plastic encapsulated microcircuits; plastic-encapsulated microcircuit dormant storage testing; Delamination; Encapsulation; Inspection; Integrated circuit packaging; Performance evaluation; Dormant storage; highly accelerated stress testing; physics of failure; plastic integrated circuit packaging; scanning acoustic microscopy; scanning acoustic microscopy.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2358574

Filename

6936322