• DocumentCode
    110487
  • Title

    A 40 Gb/s Optical Bus for Optical Backplane Interconnections

  • Author

    Bamiedakis, N. ; Hashim, Aniqah ; Penty, Richard V. ; White, Ian H.

  • Author_Institution
    Eng. Dept., Univ. of Cambridge, Cambridge, UK
  • Volume
    32
  • Issue
    8
  • fYear
    2014
  • fDate
    15-Apr-14
  • Firstpage
    1526
  • Lastpage
    1537
  • Abstract
    Optical technologies have received large interest in recent years for use in board-level interconnects. Polymer multimode waveguides in particular, constitute a promising technology for high-capacity optical backplanes as they can be cost-effectively integrated onto conventional printed circuit boards (PCBs). This paper presents the first optical backplane demonstrator based on the use of PCB-integrated polymer multimode waveguides and a regenerative shared bus architecture. The backplane demonstrator is formed with commercially-available low-cost electronic and photonic components onto conventional FR4 substrates and comprises two opto-electronic (OE) bus modules interconnected via a prototype regenerator unit. The system enables interconnection between the connected cards over four optical channels, each operating at 10 Gb/s. Bus extension is achieved by cascading OE bus modules via 3R regenerator units, overcoming therefore the inherent limitation of optical bus topologies in the maximum number of cards that can be connected to the bus. Details of the design, fabrication, and assembly of the different parts of this optical bus backplane are presented and related optical and data transmission characterisation studies are reported. The optical layer of the OE bus modules comprises a four-channel three-card waveguide layout that is compatible with VCSEL/PD arrays and ribbon fibres. All on-board optical paths exhibit insertion losses below 13 dB and intra-channel crosstalk lower than -29 dB. The robustness of the signal distribution from the bus inputs to all respective bus output ports in the presence of input misalignment is demonstrated, while 1 dB input alignment tolerances of approximately ±10 μm are obtained. The electrical layer of the OE bus modules comprises the essential driving circuitry for 1×4 VCSEL and PD arrays and the corresponding control and power regulation circuits. The interface between the optical and electrical layers o- the bus modules is achieved with simple OE connectors that enable end-fired optical coupling into and out of the on-board polymer waveguides. The backplane demonstrator achieves error-free (BER <; 10-12) 10 Gb/s data transmission over each optical channel, enabling therefore, an aggregate interconnection capacity of 40 Gb/s between any connected cards.
  • Keywords
    integrated optoelectronics; optical backplanes; optical crosstalk; optical design techniques; optical fabrication; optical losses; optical polymers; optical waveguides; 3R regenerator units; FR4 substrates; PCB-integrated polymer multimode waveguides; aggregate interconnection capacity; bit rate 10 Gbit/s; bit rate 40 Gbit/s; bus inputs; bus output ports; connected cards; driving circuitry; electrical layer; end- fired optical coupling; error-free data transmission; four-channel three-card waveguide layout; input alignment tolerances; insertion losses; intrachannel crosstalk; low-cost electronic components; on-board optical paths; on-board polymer waveguides; optical backplane demonstrator; optical backplane interconnections; optical bus backplane design; optical bus backplane fabrication; optical bus topology; optical channel; optical channels; optical layer; optoelectronic bus modules; optoelectronic connectors; photonic components; power regulation circuits; printed circuit board; prototype regenerator unit; regenerative shared bus architecture; signal distribution; Optical device fabrication; Optical fibers; Optical interconnections; Optical polymers; Optical receivers; Repeaters; Optical backplanes; optical interconnects; optoelectronic integration; polymer waveguides;
  • fLanguage
    English
  • Journal_Title
    Lightwave Technology, Journal of
  • Publisher
    ieee
  • ISSN
    0733-8724
  • Type

    jour

  • DOI
    10.1109/JLT.2014.2306983
  • Filename
    6746229