• DocumentCode
    110827
  • Title

    Millimeter-Wave Wireless Interconnect for 3-D SIC Testing

  • Author

    Lu, Julia Hsin-Lin ; Wing-Fai Loke ; Byunghoo Jung

  • Author_Institution
    Purdue Univ., West Lafayette, IN, USA
  • Volume
    31
  • Issue
    6
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    29
  • Lastpage
    37
  • Abstract
    As 3-D ICs gain popularity in the industry, finding an efficient way to test the stacked chips is becoming a new challenge. The authors of this paper present a contact-free testing method using millimeter-wave wireless I/Os with microbump antennas. This method has the potential to reduce the latency and cost of 3-D IC testing.
  • Keywords
    integrated circuit interconnections; integrated circuit testing; millimetre wave antennas; millimetre wave integrated circuits; three-dimensional integrated circuits; 3D SIC testing; I-O; contact-free testing method; microbump antennas; millimeter-wave wireless interconnect; stacked integrated circuits; Antennas; Integrated circuit interconnections; Millimeter wave circuits; Silicon; Silicon carbide; Testing; Transceivers; Wireless communication;
  • fLanguage
    English
  • Journal_Title
    Design & Test, IEEE
  • Publisher
    ieee
  • ISSN
    2168-2356
  • Type

    jour

  • DOI
    10.1109/MDAT.2014.2343191
  • Filename
    6866185
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=110827