DocumentCode
1108450
Title
Special issue on Packaging Reliability
Volume
55
Issue
4
fYear
2008
fDate
4/1/2008 12:00:00 AM
Firstpage
1098
Lastpage
1098
Abstract
Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.920916
Filename
4475403
Link To Document