DocumentCode
11100
Title
Comparison of Polished and Dry Etched Semipolar
III-Nitride Laser Facets
Author
Po Shan Hsu ; Farrell, R.M. ; Weaver, Jeremiah J. ; Fujito, K. ; DenBaars, Steven P. ; Speck, James S. ; Nakamura, Shigenari
Author_Institution
Mater. Dept. & Electr. & Comput. Eng. Dept., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
Volume
25
Issue
21
fYear
2013
fDate
Nov.1, 2013
Firstpage
2105
Lastpage
2107
Abstract
We compare facet morphology, device characteristics, and far field patterns (FFPs) for semipolar (112̅2) laser diodes fabricated with mechanically polished and dry etched mirror facets. Facets formed by Cl2-based dry etching produced inclined and heavily striated facets. Mechanically polished facets, in contrast, provided vertical and smooth facets (rms roughness=5.2 nm). The threshold currents of polished facet devices were on average ~ 100 and ~ 200 mA lower than etched facet devices (2 × 1200 μm2 and 4 × 1200 μm2 dimension devices, respectively). FFPs from etched facets were also shown to be obscured due to substrate reflections.
Keywords
III-V semiconductors; etching; gallium compounds; laser mirrors; optical fabrication; polishing; semiconductor lasers; surface morphology; surface roughness; wide band gap semiconductors; GaN; device characteristics; dry etched mirror facets; dry etching; facet morphology; far field patterns; laser diodes; mechanical polishing; optical fabrication; semipolar (112̅2) III-nitride laser facets; surface roughness; threshold currents; Diode lasers; Dry etching; Gallium nitride; Mirrors; Physics; Substrates; Threshold current; Facets; GaN; III-nitride; lasers; nonpolar; semipolar;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2013.2281608
Filename
6600954
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