DocumentCode
1111677
Title
Low-noise HEMT using MOCVD
Author
Tanaka, Kuninobu ; Ogawa, Masamichi ; Togashi, Kou ; Takakuwa, Hidemi ; Ohke, Hajime ; Kanazawa, Masayoshi ; Kato, Yoji ; Watanabe, Seiichi
Author_Institution
Sony Corporation, Atsugi, Kanagawa, Japan
Volume
33
Issue
12
fYear
1986
fDate
12/1/1986 12:00:00 AM
Firstpage
2053
Lastpage
2058
Abstract
Low-noise HEMT AlGaAs/GaAs heterostructure devices have been developed using metal organic chemical vapor deposition (MOCVD). The HEMT´s with 0.5-µm-long and 200-µm-wide gates have shown a minimum noise figure of 0.83 dB with an associated gain of 12.5 dB at 12 GHz at room temperature. Measurements have confirmed calculations on the effect of the number of gate bonding pads On the noise figure for different gate Widths. Substantial noise figure improvement was observed Under low-temperature operation, especially compared to conventional GaAs MESFET´s. A two-stage amplifier designed for DBS reception using the HEMT in the first stage has displayed a noise figure under 2.0 dB from 11.7 to 12.2 GHz.
Keywords
Bonding; Chemical vapor deposition; Gain; Gallium arsenide; HEMTs; MOCVD; Noise figure; Noise measurement; Organic chemicals; Temperature measurement;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1986.22867
Filename
1486084
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