• DocumentCode
    1111677
  • Title

    Low-noise HEMT using MOCVD

  • Author

    Tanaka, Kuninobu ; Ogawa, Masamichi ; Togashi, Kou ; Takakuwa, Hidemi ; Ohke, Hajime ; Kanazawa, Masayoshi ; Kato, Yoji ; Watanabe, Seiichi

  • Author_Institution
    Sony Corporation, Atsugi, Kanagawa, Japan
  • Volume
    33
  • Issue
    12
  • fYear
    1986
  • fDate
    12/1/1986 12:00:00 AM
  • Firstpage
    2053
  • Lastpage
    2058
  • Abstract
    Low-noise HEMT AlGaAs/GaAs heterostructure devices have been developed using metal organic chemical vapor deposition (MOCVD). The HEMT´s with 0.5-µm-long and 200-µm-wide gates have shown a minimum noise figure of 0.83 dB with an associated gain of 12.5 dB at 12 GHz at room temperature. Measurements have confirmed calculations on the effect of the number of gate bonding pads On the noise figure for different gate Widths. Substantial noise figure improvement was observed Under low-temperature operation, especially compared to conventional GaAs MESFET´s. A two-stage amplifier designed for DBS reception using the HEMT in the first stage has displayed a noise figure under 2.0 dB from 11.7 to 12.2 GHz.
  • Keywords
    Bonding; Chemical vapor deposition; Gain; Gallium arsenide; HEMTs; MOCVD; Noise figure; Noise measurement; Organic chemicals; Temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1986.22867
  • Filename
    1486084