DocumentCode :
1111856
Title :
Close drain—Source self-aligned high electron mobility transistors
Author :
Sheng, N.H. ; Chang, M.F. ; Lee, C.P. ; Miller, D.L. ; Chen, R.T.
Author_Institution :
Rockwell International Corporation, Thousand Oaks, CA
Volume :
7
Issue :
1
fYear :
1986
fDate :
1/1/1986 12:00:00 AM
Firstpage :
11
Lastpage :
12
Abstract :
A new self-aligned process for high-electron mobility transistors has been developed. This process uses a photoresist dummy gate to self-align the ohmic contacts. The resulting structure has very closely spaced source and drain. For 1-µm gate transistors, device transconductances as high as 320 ms/mm have been achieved at room temperature.
Keywords :
Alloying; Fabrication; HEMTs; Impurities; MESFETs; MODFETs; Metallization; Ohmic contacts; Resists; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26275
Filename :
1486098
Link To Document :
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