• DocumentCode
    1114161
  • Title

    1-cc Computer: Cross-Layer Integration With UWB-IR Communication and Locationing

  • Author

    Nakagawa, Tatsuo ; Ono, Goichi ; Fujiwara, Ryosuke ; Norimatsu, Takayasu ; Terada, Takahide ; Miyazaki, Masayuki ; Suzuki, Kei ; Yano, Kazuo ; Ogata, Yuji ; Maeki, Akira ; Kobayashi, Shinsuke ; Koshizuka, Noboru ; Sakamura, Ken

  • Author_Institution
    Hitachi Ltd., Tokyo
  • Volume
    43
  • Issue
    4
  • fYear
    2008
  • fDate
    4/1/2008 12:00:00 AM
  • Firstpage
    964
  • Lastpage
    973
  • Abstract
    The first one-cc or one-cubic-centimeter computer (OCCC) that integrates a sensor, ultra-wideband impulse radio (UWB-IR) transmitter, computing engine, and battery is demonstrated. Cross-layer integration includes SPIKE control, which achieves a record low power communication of 3.4-nW/bps with reduced operating time. Miniaturization techniques, such as wafer-level chip-size packaging and flip-chip packaging, were used to shrink the module to a volume of 1 cc. The fabricated OCCC is shown to operate as designed, communicating at distances of 10 and 30 m and at transmission rates of 10.7 Mbps and 258 kbps, respectively. The life of a 150-mAh battery in an OCCC that operates once every five minutes is estimated to be longer than 10 years. The communication-location integration (CLI) technique, which achieves 22-cm location accuracy with only a 1.3% chip area overhead, is also proposed.
  • Keywords
    flip-chip devices; low-power electronics; microcomputers; radio direction-finding; radio transmitters; ultra wideband communication; wafer level packaging; SPIKE control; UWB-IR transmitter; communication-location integration; cross-layer integration; flip-chip packaging; low power communication; miniaturization techniques; one-cubic-centimeter computer; ultra-wideband impulse radio transmitter; wafer-level chip-size packaging; Batteries; Communication system control; Laboratories; Medical services; Military computing; Mobile communication; Packaging; Personal digital assistants; Ultra wideband technology; Wafer scale integration; 1-cc computer; locationing; low power; ultra-wideband impulse radio (UWB-IR);
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2008.917543
  • Filename
    4476502