• DocumentCode
    1114432
  • Title

    A Recovery Algorithm of Linear Complexity in the Time-Domain Layered Finite Element Reduction Recovery (LAFE-RR) Method for Large-Scale Electromagnetic Analysis of High-Speed ICs

  • Author

    Gan, Houle ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • Volume
    31
  • Issue
    3
  • fYear
    2008
  • Firstpage
    612
  • Lastpage
    618
  • Abstract
    Time-domain layered finite element reduction recovery (LAFE-RR) method was recently developed for large-scale electromagnetic analysis of high-speed integrated circuits (ICs). This method is capable of analytically and rigorously reducing the system matrix of a 3-D multilayer circuit to that of a single-layer one regardless of the original problem size. In addition, the reduced system matrix preserves the sparsity of the original system matrix. In this paper, an efficient algorithm is proposed to recover the volume unknowns in the time-domain LAFE-RR method. This algorithm constitutes a direct solution of the matrix formed by volume unknowns in each layer. This direct solution possesses a linear complexity in both central processing unit (CPU) time and memory consumption. The cost of matrix inversion is negligible. The cost of matrix solution scales linearly with the matrix size. Numerical and experimental results have demonstrated the accuracy and efficiency of the proposed algorithm.
  • Keywords
    VLSI; computational complexity; finite element analysis; high-speed integrated circuits; matrix algebra; time-domain analysis; 3D multilayer circuit; central processing unit time; high-speed ICs; high-speed integrated circuits; large-scale electromagnetic analysis; linear complexity; matrix inversion; memory consumption; system matrix; time-domain layered finite element reduction recovery method; very large scale integrated circuits; Electromagnetic analysis; finite-element methods; time domain analysis; very large scale integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2008.920648
  • Filename
    4476764