Abstract :
A leading semiconductor design software-tool vendor has developed an approach that would increase chip performance by running wiring diagonally as well as horizontally and vertically, as is the case now - between transistors, on-chip memory, and other processor elements. This paper discusses the advantages of Candence´s X Architecture approach that uses wiring which runs diagonally along with the connections that run horizontally or vertically in some layers.
Keywords :
circuit CAD; semiconductor devices; software tools; wiring; Candence X Architecture; diagonal wiring; semiconductor design; software-tool vendor; Energy efficiency; Fixtures; Integrated circuit interconnections; Lead compounds; Light emitting diodes; Routing; Semiconductor device manufacture; Tracking; Wires; Wiring; LED technology; herd computing; semiconductor technology; spyware; wireless technology;
