DocumentCode :
1121571
Title :
The impact of N-drain length and gate—drain/source overlap on submicrometer LDD devices for VLSI
Author :
Izawa, Ryuichi ; Takeda, Eiji
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Volume :
8
Issue :
10
fYear :
1987
fDate :
10/1/1987 12:00:00 AM
Firstpage :
480
Lastpage :
482
Abstract :
To obtain optimal values for the key factors in enchancing the reliability and performance of deep submicrometer lightly doped drain (LDD) structures, the influence of LDD device parameters-n-drain length Ln, gate-drain/source overlap length Γ, and n- dose Nd-on reliability and performance were investigated using a three-dimensional (3-D) device simulator and experiment. A new device structure is discussed as a guide for deep submicrometer LDD design. This structure makes an advantageous use of the gate-drain overlap effect without scaling of Lnand Γ.
Keywords :
Degradation; Guidelines; Helium; Hot carriers; Neodymium; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1987.26701
Filename :
1487251
Link To Document :
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