DocumentCode
112196
Title
Development of a Technique for Characterizing Bias Temperature Instability-Induced Device-to-Device Variation at SRAM-Relevant Conditions
Author
Meng Duan ; Jian Fu Zhang ; Zhigang Ji ; Wei Dong Zhang ; Kaczer, Ben ; Schram, Tom ; Ritzenthaler, Romain ; Groeseneken, Guido ; Asenov, Asen
Author_Institution
Sch. of Eng., John Moores Univ., Liverpool, UK
Volume
61
Issue
9
fYear
2014
fDate
Sept. 2014
Firstpage
3081
Lastpage
3089
Abstract
SRAM is vulnerable to device-to-device variation (DDV), since it uses minimum-sized devices and requires device matching. In addition to the as-fabricated DDV at time-zero, aging induces a time-dependent DDV (TDDV). Bias temperature instability (BTI) is a dominant aging process. A number of techniques have been developed to characterize the BTI, including the conventional pulse-(I) -(V) , random telegraph noises, time-dependent defect spectroscopy, and TDDV accounting for the within-device fluctuation. These techniques, however, cannot be directly applied to SRAM, because their test conditions do not comply with typical SRAM operation. The central objective of this paper is to develop a technique suitable for characterizing both the negative BTI (NBTI) and positive BTI (PBTI) in SRAM. The key issues addressed include the SRAM relevant sensing Vg, measurement delay, capturing the upper envelope of degradation, sampling rate, and measurement time window. The differences between NBTI and PBTI are highlighted. The impact of NBTI and PBTI on the cell-level performance is assessed by simulation, based on experimental results obtained from individual devices. The simulation results show that, for a given static noise margin, test conditions have a significant effect on the minimum operation bias.
Keywords
SRAM chips; ageing; integrated circuit noise; negative bias temperature instability; random noise; NBTI; PBTI; SRAM; negative bias temperature instability; positive bias temperature instability; random telegraph noise; static noise margin; time-dependent defect spectroscopy; time-dependent device-to-device variation; Degradation; MOSFET; Random access memory; Stress; Stress measurement; Time measurement; Video recording; Aging-induced variation; charge fluctuation; degradation; device variability; device-to-device variation; lifetime; negative bias temperature instabilities; statistical variation; time-dependent variation; time-dependent variation.;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2335053
Filename
6866905
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