DocumentCode
1127167
Title
Scalar magnetostatic potential approach to the prediction of the excess inductance of grounded via´s and via´s through a hole in a ground plane
Author
Kok, Peter A. ; Zutter, Daniel De
Author_Institution
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
Volume
42
Issue
7
fYear
1994
fDate
7/1/1994 12:00:00 AM
Firstpage
1229
Lastpage
1237
Abstract
A quasi-static method is described for calculating the excess inductance of via´s. The considered via geometry contains connecting strips, pads on the via, and a finite ground plane thickness. An integral equation based on the scalar magnetic potential ψ is solved. The inductance is found by calculating the magnetic flux through a cut introduced to define ψ in an unequivocal way. The problem is generally solved for via through-holes; the grounded via-configuration is found as a limiting case. The influence of the geometric parameters on the via inductance is examined
Keywords
inductance; magnetic flux; magnetostatics; printed circuit design; connecting strips; excess inductance; finite ground plane thickness; geometric parameters; ground plane; grounded via; inductance; integral equation; magnetic flux; quasi-static method; scalar magnetic potential; scalar magnetostatic potential; via geometry; via inductance; via through-holes; Capacitance; Dielectric substrates; Geometry; Inductance; Integral equations; Joining processes; Magnetic flux; Magnetostatics; Microstrip; Printed circuits;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.299761
Filename
299761
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