• DocumentCode
    1127167
  • Title

    Scalar magnetostatic potential approach to the prediction of the excess inductance of grounded via´s and via´s through a hole in a ground plane

  • Author

    Kok, Peter A. ; Zutter, Daniel De

  • Author_Institution
    Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
  • Volume
    42
  • Issue
    7
  • fYear
    1994
  • fDate
    7/1/1994 12:00:00 AM
  • Firstpage
    1229
  • Lastpage
    1237
  • Abstract
    A quasi-static method is described for calculating the excess inductance of via´s. The considered via geometry contains connecting strips, pads on the via, and a finite ground plane thickness. An integral equation based on the scalar magnetic potential ψ is solved. The inductance is found by calculating the magnetic flux through a cut introduced to define ψ in an unequivocal way. The problem is generally solved for via through-holes; the grounded via-configuration is found as a limiting case. The influence of the geometric parameters on the via inductance is examined
  • Keywords
    inductance; magnetic flux; magnetostatics; printed circuit design; connecting strips; excess inductance; finite ground plane thickness; geometric parameters; ground plane; grounded via; inductance; integral equation; magnetic flux; quasi-static method; scalar magnetic potential; scalar magnetostatic potential; via geometry; via inductance; via through-holes; Capacitance; Dielectric substrates; Geometry; Inductance; Integral equations; Joining processes; Magnetic flux; Magnetostatics; Microstrip; Printed circuits;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.299761
  • Filename
    299761