Title :
Effect of physical aging on dielectric, thermal and mechanical properties of cast-epoxy insulators
Author :
Li, Y. ; Unsworth, J.
Author_Institution :
Center for Mater. Technol., Univ. of Technol., Sydney, NSW, Australia
fDate :
2/1/1994 12:00:00 AM
Abstract :
Samples of cast bisphenol-A and cycloaliphatic epoxy insulation were quenched from a temperature above Tg (170°C) to room temperature. Variations in dielectric, thermal and mechanical properties were examined during subsequent sub-Tg annealing (physical aging). It was found that the impact strength of the epoxy insulation decreased considerably with physical aging. Moisture intake and subsequent dielectric loss at room temperature were also found to decrease with physical aging. Glass transition temperature and excess enthalpy measured by DSC demonstrated significant increase with increased sub-Tg annealing. On the other hand, dielectric properties showed different changing patterns during sub-Tg annealing in different epoxy systems. It is concluded that epoxy insulating materials should be properly annealed before assessing their dielectric and other physical properties because of the possibility of unknown rapid cooling histories
Keywords :
ageing; annealing; calorimetry; dielectric losses; insulation testing; life testing; organic insulating materials; quenching (thermal); DSC; annealing; bisphenol-A; cast-epoxy insulators; cycloaliphatic epoxy; dielectric loss; dielectric properties; epoxy insulating materials; excess enthalpy; glass transition temperature; mechanical properties; physical aging; rapid cooling histories; thermal properties; Aging; Annealing; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Glass; Mechanical factors; Moisture; Temperature;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on