Author_Institution :
StratEdge Corp., San Diego, CA, USA
Abstract :
Advances in integrated circuit technologies have produced devices with higher speeds, frequencies, powers, and functional complexity. In addition, these attributes have been realized with smaller and smaller semiconductor devices. Such improvements are primarily due to the effective control and management of wafer-scale interconnect technology. It has become apparent, however, that the next level of interconnect technology to be addressed is in the packaging of these high performance semiconductors. As frequency or speed increases, packaging can quickly become the chief inhibitor to electrical response by degrading signal propagation or by contributing to structural configurations that foster cavity resonances or waveguide modes. The paper attempts to lay out the electrical, structural, material, and cost considerations that need to be simultaneously addressed by the microwave engineer to design the best interconnection method possible between the die and the subsystem. Several packaging concepts are reviewed-from single transition design to multilayer, multichip modules for phased-array applications
Keywords :
MIMIC; MMIC; antenna accessories; antenna phased arrays; ceramics; integrated circuit interconnections; integrated circuit packaging; millimetre wave antenna arrays; multichip modules; advanced ceramic packaging; cost considerations; electrical considerations; integrated circuit technologies; interconnection method; material considerations; microwave applications; millimeter wave applications; multilayer multichip modules; packaging; phased-array applications; single transition design; structural considerations; wafer-scale interconnect technology; Ceramics; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Microwave devices; Millimeter wave integrated circuits; Millimeter wave technology; Semiconductor device packaging; Semiconductor devices;