DocumentCode
1134877
Title
A complete small-signal equivalent circuit model of cooled butterfly-type 2.5 Gbps DFB laser modules and its application to improve high frequency characteristics
Author
Jaehoon Lee ; Nam, Seungki ; Lee, Jaehoon ; Jeong, Jichai
Author_Institution
Dept. of Radio Eng., Korea Univ., Seoul, South Korea
Volume
25
Issue
4
fYear
2002
fDate
11/1/2002 12:00:00 AM
Firstpage
543
Lastpage
548
Abstract
A small-signal equivalent circuit model of 2.5 Gbps DFB laser modules with butterfly-type dual-in-line packages has been proposed and verified using extracted parameters. Parameters related to the equivalent circuit have been extracted from measured S parameters using the modified two-port black box model. This model includes small-signal equivalent circuits of components used for 2.5 Gbps DFB laser modules such as DFB laser, coplanar waveguides, matching resistor, bonding wires, and thermoelectric cooler (TEC). From this equivalent circuit modeling, we show that calculated frequency characteristics of DFB lasers on submount and complete DFB laser modules are similar to their measured frequency characteristics, respectively. Based on this equivalent circuit model, we propose and demonstrate a method that can improve frequency characteristics of 2.5 Gbps DFB laser modules through both experiments and simulations.
Keywords
S-parameters; cooling; coplanar waveguides; distributed feedback lasers; equivalent circuits; optical transmitters; semiconductor device packaging; semiconductor lasers; 2.5 Gbit/s; bonding wires; cooled butterfly-type DFB laser modules; coplanar waveguides; dual-in-line packages; extracted parameters; frequency characteristics; high frequency characteristics; matching resistor; measured S parameters; small-signal equivalent circuit model; thermoelectric cooler; two-port black box model; Bonding; Coplanar waveguides; Equivalent circuits; Frequency; Laser modes; Packaging; Resistors; Scattering parameters; Waveguide components; Waveguide lasers;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2002.807562
Filename
1176482
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