• DocumentCode
    1134877
  • Title

    A complete small-signal equivalent circuit model of cooled butterfly-type 2.5 Gbps DFB laser modules and its application to improve high frequency characteristics

  • Author

    Jaehoon Lee ; Nam, Seungki ; Lee, Jaehoon ; Jeong, Jichai

  • Author_Institution
    Dept. of Radio Eng., Korea Univ., Seoul, South Korea
  • Volume
    25
  • Issue
    4
  • fYear
    2002
  • fDate
    11/1/2002 12:00:00 AM
  • Firstpage
    543
  • Lastpage
    548
  • Abstract
    A small-signal equivalent circuit model of 2.5 Gbps DFB laser modules with butterfly-type dual-in-line packages has been proposed and verified using extracted parameters. Parameters related to the equivalent circuit have been extracted from measured S parameters using the modified two-port black box model. This model includes small-signal equivalent circuits of components used for 2.5 Gbps DFB laser modules such as DFB laser, coplanar waveguides, matching resistor, bonding wires, and thermoelectric cooler (TEC). From this equivalent circuit modeling, we show that calculated frequency characteristics of DFB lasers on submount and complete DFB laser modules are similar to their measured frequency characteristics, respectively. Based on this equivalent circuit model, we propose and demonstrate a method that can improve frequency characteristics of 2.5 Gbps DFB laser modules through both experiments and simulations.
  • Keywords
    S-parameters; cooling; coplanar waveguides; distributed feedback lasers; equivalent circuits; optical transmitters; semiconductor device packaging; semiconductor lasers; 2.5 Gbit/s; bonding wires; cooled butterfly-type DFB laser modules; coplanar waveguides; dual-in-line packages; extracted parameters; frequency characteristics; high frequency characteristics; matching resistor; measured S parameters; small-signal equivalent circuit model; thermoelectric cooler; two-port black box model; Bonding; Coplanar waveguides; Equivalent circuits; Frequency; Laser modes; Packaging; Resistors; Scattering parameters; Waveguide components; Waveguide lasers;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2002.807562
  • Filename
    1176482