DocumentCode :
1136909
Title :
Novel hybrid method for efficient 3-D fiber-to-chip coupling analysis
Author :
Vukovic, Ana ; Sewell, Phillip ; Benson, Trevor M. ; Bozeat, Robert J.
Author_Institution :
Sch. of Electr. & Electron. Eng., Univ. of Nottingham, UK
Volume :
8
Issue :
6
fYear :
2002
Firstpage :
1285
Lastpage :
1293
Abstract :
An efficient hybrid method has been developed to analyze, for the first time, the three-dimensional problem of fiber-to-chip coupling. The method employs the numerical finite difference beam propagation method to model the fields in the planar chip guide and the semi-analytical free space radiation mode method to model the fields in the fiber guide. The two methods are linked via an iterative algorithm. The results for the transmission, backreflection, and radiation losses are presented for the case of direct butt-coupling and coupling via an antireflection coating. Finally, the effect of the vertical misalignment is analyzed and results are compared with the ones obtained experimentally.
Keywords :
antireflection coatings; convergence of numerical methods; finite difference methods; integrated optics; integrated optoelectronics; iterative methods; light reflection; light transmission; optical fibre couplers; optical fibre losses; optical losses; rib waveguides; antireflection coating; backreflection losses; direct butt-coupling; efficient 3D fiber-to-chip coupling analysis; fiber guide; hybrid method; iterative algorithm; numerical finite difference beam propagation method; optoelectronic integrated circuits; planar chip guide; radiation losses; rib waveguides; semi-analytical free space radiation mode method; three-dimensional problem; transmission losses; vertical misalignment; Application software; Coatings; Coupling circuits; Finite difference methods; Iterative algorithms; Optical coupling; Optical fiber devices; Optical waveguides; Programmable control; Silicon on insulator technology;
fLanguage :
English
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher :
ieee
ISSN :
1077-260X
Type :
jour
DOI :
10.1109/JSTQE.2002.806722
Filename :
1176671
Link To Document :
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