DocumentCode :
1139189
Title :
A 20-ps Si bipolar IC using advanced super self-aligned process technology with collector ion implantation
Author :
Konaka, Shinsuke ; Yamamoto, Eiichi ; Sakuma, Kazuhito ; Amemiya, Yoshito ; Sakai, Tetsushi
Author_Institution :
NTT Corp., Kanagawa, Japan
Volume :
36
Issue :
7
fYear :
1989
fDate :
7/1/1989 12:00:00 AM
Firstpage :
1370
Lastpage :
1375
Abstract :
A super self-aligned process technology, SST-1B, which is an advanced version of the previously proposed SST-1A in high-speed Si bipolar LSIs is discussed. A selectively ion-implanted collector (SIC) process and bird´s-beak-free isolation process are utilized. The SIC process is designed to improve shallow base-collector profiles in the intrinsic region. It reduces base width and intrinsic base resistance, and suppresses the base push-out effect (Kirk´s effect) in high-current operations. The SIC profile is easily controlled by 150-200 keV phosphorous ion implantation at the base-collector junction. Using these processes, SST-1B has achieved a high cutoff frequency of 21.1 to 25.7 GHz and a fast switching delay of 20.5 ps/G for nonthreshold logic and 34.1 ps/G for emitter-coupled logic. SST-1B has potential applications to 50-ps/G logic LSIs and 10-GHz SSIs. Device simulation indicates that it is possible to achieve a cutoff frequency of 40-50 GHz in a future scaled-down Si bipolar transistor with a 40-nm base and graded collector
Keywords :
bipolar integrated circuits; elemental semiconductors; integrated circuit technology; integrated logic circuits; ion implantation; silicon; 150 to 200 keV; 20 ps; 21.1 to 25.7 GHz; Kirk´s effect; SSIs; SST-1B; Si:P; advanced super self-aligned process technology; base push-out effect; base width; base-collector junction; bipolar IC; bird´s-beak-free isolation process; collector ion implantation; cutoff frequency; emitter-coupled logic; graded collector; intrinsic base resistance; logic LSIs; nonthreshold logic; shallow base-collector profiles; Bipolar integrated circuits; Bipolar transistors; Cutoff frequency; Delay; Ion implantation; Isolation technology; Kirk field collapse effect; Logic devices; Process design; Silicon carbide;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.30943
Filename :
30943
Link To Document :
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