DocumentCode :
1143012
Title :
Analysis of packaged microwave integrated circuits by FDTD
Author :
Mezzanotte, Paolo ; Mongiardo, Mauro ; Roselli, Luca ; Sorrentino, Roberto ; Heinrich, Wolfgang
Author_Institution :
Istituto di Elettronica, Perugia Univ., Italy
Volume :
42
Issue :
9
fYear :
1994
fDate :
9/1/1994 12:00:00 AM
Firstpage :
1796
Lastpage :
1801
Abstract :
The behavior of packaged single and coupled MMIC via-hole grounds has been investigated by using a graded mesh FDTD code running on the massive parallel computer DEC 12000 with 4 K processors. Theoretical simulations have been compared with experimental measurements showing excellent agreement. Moreover, since the package introduces resonances, we have also investigated several different possibilities to choke off these resonances. It is shown that the common practice of inserting a damping layer just below the lid is often not effective. In particular, the importance of placing damping layers also on the side walls is demonstrated
Keywords :
MMIC; circuit analysis computing; finite difference time-domain analysis; microstrip components; packaging; parallel algorithms; resonance; DEC 12000; MMIC; damping layers; graded mesh FDTD code; massive parallel computer; packaged microwave integrated circuits; resonances; simulation; via-hole grounds; Computational modeling; Concurrent computing; Coupling circuits; Damping; Finite difference methods; Integrated circuit packaging; MMICs; Microwave integrated circuits; Resonance; Time domain analysis;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.310590
Filename :
310590
Link To Document :
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