DocumentCode
1144191
Title
Remote heat sink concept for high power heat rejection
Author
Webb, Ralph L. ; Yamauchi, Shinobu ; Denko, S. ; Tochigi, K.K.
Author_Institution
Dept. of Mech. Eng., Penn State Univ., University Park, PA, USA
Volume
25
Issue
4
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
608
Lastpage
614
Abstract
This paper addresses heat rejection concepts intended to reject 100 W (or more) from the CPU of a desktop computer or server. A high-performance, air-cooled thermo-syphon heat rejection system is described that meets the goal. This concept is believed to represent the highest performance that has been reported for an air-cooled heat rejection system. A working fluid is boiled in a small chamber mounted on the CPU, and the vapor is condensed in the tubes of the remotely located air-cooled condenser. The air-cooled heat exchanger provides much higher performance than is obtainable with conventional "round-tube" technology. The boiling design is compared with other systems that have been proposed, e.g., liquid or two-phase cooling in micro-channels, and is shown to provide better performance. The heat exchange technology may also be applied to refrigerated cooling.
Keywords
cooling; heat exchangers; heat sinks; microprocessor chips; thermal management (packaging); thermal resistance; 100 W; air-cooled heat exchanger; air-cooled thermo-syphon system; boiling design; desktop computer CPU; high power heat rejection; refrigerated cooling; remote heat sink technology; remotely located air-cooled condenser; server CPU; thermal resistance; Central Processing Unit; Cooling; Copper; Heat sinks; Heat transfer; Refrigeration; Resistance heating; Surface resistance; Temperature; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.809109
Filename
1178756
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