Title :
Analysis of a thermally enhanced ball grid array package
Author :
Guenin, Bruce M. ; Marrs, Robert C. ; Molnar, Ronald J.
Author_Institution :
Adv. Products Operation, Amkor Electron. Inc., Chandler, AZ, USA
fDate :
12/1/1995 12:00:00 AM
Abstract :
A thermally enhanced ball grid array package (SuperBGA package) has been developed. Its thermal performance has been analyzed using a nonlinear, lumped parameter model. This model uses a temperature-dependent heat transfer coefficient which accounts for the natural, mixed, and forced convection regimes and radiative heat transfer. The accuracy of the model is verified experimentally using one package size. The model is then used to predict the thermal performance of other package sizes and to rationalize the high level of thermal performance exhibited by the package
Keywords :
convection; cooling; digital simulation; heat radiation; integrated circuit packaging; plastic packaging; SuperBGA package; forced convection; mixed convection; natural convection; nonlinear lumped parameter model; package size; radiative heat transfer; temperature-dependent heat transfer coefficient; thermally enhanced ball grid array package; Bonding; Electronic packaging thermal management; Electronics packaging; Heat transfer; Laminates; Nonhomogeneous media; Plastics; Predictive models; Thermal conductivity; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
