The evolution of IBM high performance cooling technology

Author

Simons, Robert E.

Author_Institution

Poughkeepsie, NY, USA

Volume

18

Issue

4

fYear

1995

fDate

12/1/1995 12:00:00 AM

Firstpage

805

Lastpage

811

Abstract

This paper provides a perspective and review of the evolution of high performance cooling technology that has been developed and used in IBM medium and large-scale computers over the past 25 years. Package cooling technology and its evolution, leading to the development of the thermal conduction module (TCM) is described. The development of air cooling technology is discussed; along with enhancements using turbulators, air-to liquid heat exchangers, and impinging flow. The development of water cooling and direct liquid immersion technology is also covered

Keywords

IBM computers; cooling; fault tolerant computing; heat conduction; heat exchangers; packaging; reliability; reviews; IBM; air cooling technology; air-to liquid heat exchangers; cooling technology; direct liquid immersion technology; impinging flow; large-scale computers; medium-scale computers; package cooling; thermal conduction module; turbulators; water cooling; Electron tubes; Electronics cooling; Electronics packaging; Integrated circuit technology; Large scale integration; Paper technology; Thermal conductivity; Thermal management of electronics; Very large scale integration; Water heating;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.477467

Filename

477467