• DocumentCode
    1147477
  • Title

    Transient Chip-Package Cosimulation of Multiscale Structures Using the Laguerre-FDTD Scheme

  • Author

    Ha, Myunghyun ; Srinivasan, Krishna ; Swaminathan, Madhavan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    32
  • Issue
    4
  • fYear
    2009
  • Firstpage
    816
  • Lastpage
    830
  • Abstract
    Transient simulation using Laguerre polynomials is unconditionally stable and is ideally suited for modeling structures containing both small and large feature sizes. The focus of this paper is on the automation of this technique and its application to chip-package cosimulation. Laguerre finite-difference time-domain (FDTD) requires using the right number of basis coefficients to generate accurate time-domain waveforms. A method for generating the optimal number of basis functions is presented in this paper. Equivalent circuit models of the FDTD grid have been developed. In addition, a method for simulation over a long time period is also presented that enables the extraction of the frequency response both at low and high frequencies. A node numbering scheme in the circuit model of the FDTD grid that is suitable for implementation has been discussed. Results from a chip-package example that shows the scalability of this technique to solve multiscale problems have been presented.
  • Keywords
    chip scale packaging; equivalent circuits; finite difference time-domain analysis; frequency response; integrated circuit modelling; stochastic processes; waveform analysis; FDTD grid; Laguerre polynomials; Laguerre-FDTD scheme; basis coefficients; basis functions; equivalent circuit models; finite-difference time-domain method; frequency response; multiscale structure; node numbering scheme; time-domain waveforms; transient chip-package cosimulation; Finite-difference time-domain (FDTD); Laguerre; unconditionally stable;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2020518
  • Filename
    5173511