• DocumentCode
    1148799
  • Title

    Thermal rating characteristics of UHF power capacitors

  • Author

    Albert, M.J.

  • Author_Institution
    Microelectronics Ltd., Rishon Le Zion, Israel
  • Volume
    17
  • Issue
    3
  • fYear
    1994
  • fDate
    9/1/1994 12:00:00 AM
  • Firstpage
    348
  • Lastpage
    353
  • Abstract
    The demands of miniaturization and high reliability of capacitors are interrelated with the characteristic physical parameters of its dielectric, electrode, and termination material constituents. The same parameters determine the thermal design and rating of a capacitor. Equally important, the circuit designer requires well-defined component data on power rating, heat dissipation, temperature, voltage, and current ratings. For the correct choice of components the supply of comprehensive information is expected from the capacitor manufacturer. While the evaluation of components in their real-life mounting and thermal conditions of system environment is beyond the scope of manufacturers´ inspection, valuable information may be gained from the dielectric loss-frequency characteristics of the capacitors. Thermal ratings for both thick- and thin-film dielectric single-and multi-layer capacitors were evaluated using ESR-frequency characteristics and calculated conditions of thermal equilibrium. The methods of evaluation and its results are shown for a number of types of multilayer porcelain capacitors
  • Keywords
    ceramics; modelling; power capacitors; reliability; thermal analysis; thermal resistance; thick film capacitors; thin film capacitors; ESR-frequency characteristics; UHF power capacitors; dielectric loss-frequency characteristics; multi-layer capacitors; multilayer porcelain capacitors; single-layer capacitors; thermal model; thermal rating characteristics; thick-film dielectric type; thin-film dielectric type; Circuits; Dielectric losses; Dielectric materials; Electrodes; Inspection; Manufacturing; Materials reliability; Power capacitors; Temperature; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.311742
  • Filename
    311742