DocumentCode :
1149073
Title :
Assessing time-to-failure due to conductive filament formation in multi-layer organic laminates
Author :
Rudra, Balu ; Pecht, Michael ; Jennings, David
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Volume :
17
Issue :
3
fYear :
1994
fDate :
8/1/1994 12:00:00 AM
Firstpage :
269
Lastpage :
276
Abstract :
Multi-layer organic laminates used in printed wiring boards and laminated multichip modules (MCM-L) can develop a loss of insulation-resistance between two traces, between a trace and a via, and between two vias, due to the growth of conductive filaments along the epoxy resin/glass interface. The growth of the filaments is a function of temperature, humidity, voltage, laminate material, manufacturing processes and the geometry and spacing of the conductors. In order to develop a model which can be used to establish both design guidelines for the prevention of conductive filament formation, and tests for product qualification, a design of experiments study was conducted. Temperature, humidity, and voltage were the stress parameters, and conductor spacing, conductor geometry, laminate material (FR-4, BT and CE) and surface coating (presence and absence of solder mask, solder plate, and post coat) were the laminate parameters. The experimental approach, the analyses of results, and a model for time-to-failure due to conductive filament formation which unifies this study with previous studies, are presented in this paper
Keywords :
circuit reliability; electromigration; failure analysis; laminates; multichip modules; printed circuit manufacture; soldering; MCM-L; conductive filament formation; conductor geometry; conductor spacing; design guidelines; insulation-resistance; laminate material; laminated multichip modules; multi-layer organic laminates; post coat; printed wiring boards; product qualification; solder mask; solder plate; surface coating; time-to-failure; Conducting materials; Epoxy resins; Geometry; Humidity; Insulation; Laminates; Multichip modules; Temperature; Voltage; Wiring;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.311773
Filename :
311773
Link To Document :
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