DocumentCode :
1149183
Title :
Image processing using a universal nonlinear cell and the WARP wafer
Author :
Jain, V.K. ; Lin, L.
Author_Institution :
Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
Volume :
17
Issue :
3
fYear :
1994
fDate :
8/1/1994 12:00:00 AM
Firstpage :
342
Lastpage :
349
Abstract :
Silicon implementation of many image processing algorithms has been hindered in the past due to their complexity and computational volume. This paper discusses two such algorithms, namely the `Hough transform for detection of line segments,\´ and `Backprojection in CT image reconstruction\´ as well as their wafer scale implementation. To gain a significant speed advantage, we use an advanced multi-function cell for performing any one of four nonlinear operations: (1) square-root, (2) reciprocal, (3) sine/cosine, and (4) arctangent-all realized in a single chip, available on a selectable basis. A 16 bit four-function “one cycle” VLSI chip, fabricated in 2.0 μm CMOS technology, is presently available which outputs a new result every clock cycle. Also discussed briefly is a “two-cycle” 24 bit chip, which delivers a new result every two clock cycles. Using this nonlinear cell an application level Hough transform module is developed. On a 4" WARP wafer, using 2.0 μm CMOS technology, eight such Hough modules can be configured, so as to produce the Hough transform of a 1024×1024 image in an estimated 11 ms. Similarly, six CT modules, placed on three wafers, can result in the backprojected image in 87 ms. Corresponding numbers for 1.0 μm technology are estimated at 2 ms for the Hough transform and 21 ms for the CT backprojected image because of higher clock rate and more processing cells on the wafers
Keywords :
CMOS integrated circuits; Hough transforms; VLSI; computerised tomography; digital signal processing chips; image processing equipment; image reconstruction; interpolation; silicon; 1 micron; 16 bit; 2 micron; 2 to 21 ms; 24 bit; 4 in; 87 ms; CMOS technology; CT image reconstruction; Hough transform algorithm; Hough transform module; Si; VLSI chip; WARP wafer; arctangent operation; backprojection; image processing algorithm; line segments detection; multi-function cell; nonlinear operations; reciprocal operation; sine/cosine operation; square-root operation; universal nonlinear cell; wafer scale implementation; CMOS technology; Clocks; Computed tomography; Computer architecture; Image processing; Image reconstruction; Image segmentation; Interpolation; Read only memory; Very large scale integration;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.311783
Filename :
311783
Link To Document :
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