DocumentCode
1162476
Title
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
Volume
28
Issue
3
fYear
2005
fDate
7/1/2005 12:00:00 AM
Abstract
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2005.856524
Filename
1506881
Link To Document