DocumentCode :
1162898
Title :
A discretization scheme that allows coarse grid-spacing in finite-difference process simulation
Author :
Lowther, R.E.
Author_Institution :
Harris Semicon., Melbourne, FL, USA
Volume :
8
Issue :
8
fYear :
1989
fDate :
8/1/1989 12:00:00 AM
Firstpage :
837
Lastpage :
841
Abstract :
The central processing unit requirements of two-dimensional numerical process simulation require much larger typical grid spacings than those used in one-dimensional simulations. With these larger grid spacings, the discretization error in diffusion simulation can have a large effect on the final simulated profile. This discretization error is analyzed and a first-order correction is applied and compared to the standard discretization method. Results show that this correction allows for a significant increase in the allowed grid spacing. As a typical example, implantation and subsequent diffusion of arsenic into silicon was modeled with different grid spacings using the SUPREM-IV program (and all its default diffusion parameters) in a one-dimensional mode. In all cases, the total dose of the implant was a constant, and differences in the implantation profile width (due to the different grid spacings) were small enough to have no significant effect on the final diffused profiles. It is seen that the standard method overestimates the amount of diffusion. The proposed method shows much better agreement between the coarse and fine grids
Keywords :
arsenic; difference equations; diffusion in solids; digital simulation; elemental semiconductors; ion implantation; physics computing; silicon; SUPREM-IV; Si:As diffusion; coarse grid-spacing; digital simulation; discretization error; finite-difference process simulation; implantation; Conductors; Design automation; Error analysis; Error correction; Finite difference methods; Finite element methods; Impurities; Joining processes; Virtual colonoscopy;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.31544
Filename :
31544
Link To Document :
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