• DocumentCode
    1167409
  • Title

    A Novel Interface for Eddy Current Displacement Sensors

  • Author

    Nabavi, Mohammad Reza ; Nihtianov, Stoyan

  • Author_Institution
    Electron. Instrum. Lab., Delft Univ. of Technol., Delft
  • Volume
    58
  • Issue
    5
  • fYear
    2009
  • fDate
    5/1/2009 12:00:00 AM
  • Firstpage
    1623
  • Lastpage
    1632
  • Abstract
    In this paper, we propose a novel interface concept for eddy current displacement sensors. A measurement method and a new front-end circuit are also proposed. The front-end circuit demonstrates excellent thermal stability, high resolution, and low-power consumption. The proposed idea is analytically investigated. The demodulation principle, as well as the interface implementation, is also addressed. This interface is being introduced for measuring submicrometer displacements in medium- to high-resolution applications. The interface system consumes less than 12 mW and has an extremely low thermal drift. The interface circuit will be implemented as a system-in-a-package (SIP). The full-scale range of displacement is 1 mm with 50-kHz signal bandwidth and 11-bit resolution (less than 500 nm). The signal conditioning circuit utilizes a standard 0.35- mum complementary metal-oxide semiconductor (CMOS) technology. Simulation results, which were achieved on the basis of experimental results of testing a prototype coil, also confirm the high performance of the interface system, as expected from analytical results. Compared with previous reports, this low-power interface system demonstrates a much lower temperature drift.
  • Keywords
    CMOS integrated circuits; demodulation; displacement measurement; eddy currents; electric sensing devices; low-power electronics; system-in-package; thermal stability; CMOS technology; SIP; bandwidth 50 kHz; complementary metal-oxide semiconductor technology; demodulation principle; eddy current displacement sensor; front-end circuit; interface implementation; low-power interface system; signal conditioning circuit; size 0.35 mum; submicrometer displacement measurement; system-in-a-package; thermal drift; thermal stability; Displacement sensors; eddy current; low-power front-end; sensor interfacing; thermal drift;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2009.2012945
  • Filename
    4785518