DocumentCode :
1170267
Title :
Where CMOS is Going: Trendy Hype vs. Real Technology
Author :
Chen, Tze-Chiang T C
Author_Institution :
IBM Fellow, VP of Science and Technology, T.J. Watson Research Center, IBM Research Division
Volume :
11
Issue :
5
fYear :
2006
Firstpage :
5
Lastpage :
9
Abstract :
Two important challenges facing Moore´s Law and continued CMOS scaling are growing standby power dissipation and the increasing variability in device characteristics. Cooperative circuit/technology co-design and architectures developed in conjunction with new materials and device structures will provide a comprehensive solution to these challenges
Keywords :
CMOS integrated circuits; Cooling; Data mining; Logic gates; Performance evaluation; Probability density function; Random access memory;
fLanguage :
English
Journal_Title :
Solid-State Circuits Society Newsletter, IEEE
Publisher :
ieee
ISSN :
1098-4232
Type :
jour
DOI :
10.1109/N-SSC.2006.4785853
Filename :
4785853
Link To Document :
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