DocumentCode
117121
Title
A novel design microgripper based on electrothermal expansion principle
Author
Sheikh, Shafiya Afzal ; Shanmuganantham, T.
Author_Institution
Dept. Of Electron. Eng., Pondicherry Univ., Pondicherry, India
fYear
2014
fDate
3-5 Jan. 2014
Firstpage
1
Lastpage
5
Abstract
In this paper, a newly modeled 3-D MEMS electrothermally actuated microgripper has been designed and simulated using COMSOL 4.3b based on finite element method (FEM). Electrothermal mechanism is the most widely used mechanism for providing large displacements at very small voltages. The new model is designed by combining asymmetric arm structure and a thin gold layer is inserted in the asymmetric arms which make it a typical bimorph structure. The microgripper presented here is electro-thermally actuated and optimized geometrically and materially to explore the effect of dimensional variation and material change on its performance. The in-plane, out of plane displacements, strain, stress, current density and temperature has been analyzed and the results are discussed.
Keywords
design engineering; finite element analysis; grippers; manipulator dynamics; micromanipulators; thermal expansion; 3D MEMS; COMSOL 4.3b; FEM; asymmetric arm structure; bimorph structure; design; electrothermal expansion principle; finite element method; microgripper; strain; stress; Actuators; Biology; Conductivity; Grippers; Nanoscale devices; Performance evaluation; Stress; COMSOL; Electrothermal Actuator; Joule Heat; MEMS; Thermal Expansion; microgripper;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Communication and Informatics (ICCCI), 2014 International Conference on
Conference_Location
Coimbatore
Print_ISBN
978-1-4799-2353-3
Type
conf
DOI
10.1109/ICCCI.2014.6921816
Filename
6921816
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