DocumentCode :
1174031
Title :
Fabrication of metal gated FinFETs through complete gate silicidation with Ni
Author :
Kedzierski, Jakub ; Ieong, Meikei ; Kanarsky, Thomas ; Zhang, Ying ; Wong, H-S Philip
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
51
Issue :
12
fYear :
2004
Firstpage :
2115
Lastpage :
2120
Abstract :
Metal-gate FinFETs were fabricated using complete gate silicidation with Ni, combining the advantages of metal-gate and double-gate transistors. NiSi-gate workfunction control is demonstrated using silicide induced impurity segregation of As, P, and B over a range of 400 mV. High device performance is achieved by integrating the NiSi metal gate with an epitaxial raised source/drain, silicided separately with CoSi2. Process considerations for this dual silicide integration scheme are discussed. Poly-Si gated FinFETs are also fabricated and used as references for workfunction and transconductance.
Keywords :
MOSFET; cobalt compounds; nickel compounds; As; B; CoSi2; NiSi; NiSi-gate workfunction control; P; double-gate transistors; dual silicide integration scheme; epitaxial raised source/drain; gate silicidation; metal gated FinFET; metal-gate transistors; poly-Si gated FinFET; silicide gate; silicide induced impurity segregation; transconductance; transistor scaling; ultrathin body; undoped body; workfunction engineering; Dry etching; FinFETs; Hafnium; Immune system; Impurities; MOSFETs; Optical device fabrication; Silicidation; Silicides; Transconductance; 65; DG; Double gate; FUSI; FinFET; NiSi; fully silicided; gate workfunction; metal gate; silicidation; silicide gate; thin body; transistor scaling; ultrathin body; undoped body; workfunction engineering;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2004.838448
Filename :
1362976
Link To Document :
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