Multilayer chip embedded based on the organic substrate

This paper mainly does research about the multilayer chip embedded based on the organic substrates. On the one hand, that puts forward a new 3D package structure of the organic substrates embedded. On the other hand, we find a kind of process flow based the whole organic substrate process and solve the key process. We completed the sample and test of the single-layer chip based the multilayer chip embedded structure. The structure realizes the high integration density 3D package based the chip embedded. That has some advantage of the package size, the electrical performance, the cost and the thermal management performance, etc. That can shorten the distance between the chip interconnection to improve the transmission performance. That can have the electromagnetic shielding effect and improves the EMC performance in the embedded system. In the process, we have done the package sample using the embedded substrate through the process and using the mature and low-cost organic substrate and micro package process and verify multilayer chip embedded process feasibility. The sample has passed tentative E-test and reliability test of reflow.