Study of gold wire bonding on 0.1 μm soft gold film substrate

Author

Ruonan Zhang ; Rui Guo ; Ming Li ; Kaiyou Qian ; Chiu, Huang-Jen

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

196

Lastpage

199

Abstract

0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3~0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam (FIB) and scanning electron microscope (SEM) observation. A design of experiments (DOE) was set up to figure out the optimistic process window for gold wire bonding on Ni-Pd-Au substrate.

Keywords

focused ion beam technology; gold; lead bonding; reliability; scanning electron microscopy; ultrasonic bonding; DOE; FIB observation; HTST; SEM observation; WPT; bondability; bonding structure; design-of-experiments; failure mode; focused ion beam observation; gold assumption; gold wire bonding; high-temperature storage test; optimistic process window; reliability; scanning electron microscope observation; size 0.3 mum to 0.5 mum; soft-gold film substrate; ultrasonic bonding; wire pull test; Bonding; Films; Gold; Nickel; Reliability; Substrates; Wires; 0.1 μm soft gold; bondability; process window; reliability; wire bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922635

Filename

6922635