Preparation of direct plated copper ceramic spreader using electroless copper as seed layer

Electroless copper plating has attracted more and more interests as an effective process for metalizing ceramic surface. Direct plated copper (DPC) ceramic spreader has been widely used for high-power LED packing. Usually, preparation of DPC used sputtering Ti/Cu for seed layer following by thick copper plating. In this work, DPC fabrication was optimized by applying the electroless plating copper as seed layer. The orthogonal experiment, single-factor analysis and other methods were used to optimize the electroless copper plating process, and the coating properties were evaluated by tensile test, scanning electron microscope (SEM) and energy dispersive spectrometer (EDS).