DocumentCode :
118456
Title :
Anti-vibration structure analysis and optimizing on BGA packaging module
Author :
Tian Wenchao ; Guan Rongcheng ; Gao Hongwei
Author_Institution :
Sch. of Electro-Mech. Eng., Xidian Univ., Xi´an, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
524
Lastpage :
528
Abstract :
BGA Packaging electronics is inevitable to be shocked and vibration in transporting and using, which make a great impact on their reliability. In this paper, a modal analysis and a random vibration analysis on a module by packaging module model of SAC305 lead-free BGA solder joints with ANSYS Workbench finite element analysis software was presented. The natural frequency and vibration model in 0~2000Hz and the maximum 3 σ equivalent stress (44.627MPa) of BGA solder are obtained. Two improvement program of structure optimization, adding fastening-ring method and adding pillar method, which can be widely used in the engineering application are highlighted. Discussing and verifying that the maximum 3 σ equivalent stress can be down to 8.7553MPa by adding fastening-ring method, and the reliability of the module resisting vibration is improved.
Keywords :
ball grid arrays; finite element analysis; modal analysis; reliability; vibrations; ANSYS Workbench finite element analysis software; BGA packaging electronics; BGA packaging module; BGA solder; SAC305 lead-free BGA solder joints; antivibration structure analysis; equivalent stress; fastening-ring method; frequency 0 Hz to 2000 Hz; modal analysis; module resisting vibration reliability; natural frequency; packaging module model; pillar method; random vibration analysis; structure optimization; vibration model; Analytical models; Modal analysis; Reliability; Safety; Soldering; Stress; Vibrations; Anti-vibration; BGA Packaging; modal analysis; random vibration analysis; structure optimization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922710
Filename :
6922710
Link To Document :
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