Effect and experiment of screw locations on BGA viscoplastic fatigue life

Author

Tian Wenchao ; Guan Rongcheng

Author_Institution

Sch. of Electro-Mech. Eng., Xidian Univ., Xi´an, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

529

Lastpage

534

Abstract

This paper establishes a packaging module of multichip with lead-free solder ball SAC305. BGA solder ball adopt nonlinear Anand viscoplasticity constitute formula. With the change factor of five screw locations, the dangerous solder ball position and stress-strain hysteresis curve are obtained through simulation with applying thermal cycling condition and screw prestress under the IPC9701 standard. Based on Coffin-Manson equation, the fatigue life of dangerous solder ball and the trend curve of solder ball life with the screw locations are deduced. And through experiments, the conclusion of the simulation is verified.

Keywords

ball grid arrays; multichip modules; solders; stress-strain relations; viscoplasticity; BGA solder ball; BGA viscoplastic fatigue life; Coffin-Manson equation; IPC9701 standard; change factor; lead-free solder SAC305; multichip; nonlinear Anand viscoplasticity constitute formula; packaging module; screw locations; screw prestress; solder ball position; stress-strain hysteresis curve; thermal cycling condition; Equations; Fasteners; Fatigue; Mathematical model; Packaging; Strain; Stress; BGA; fatigue life; screw locations; solder ball life; thermal cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922711

Filename

6922711