Title :
A novel method for IR-drop reduction in high-performance printed circuit boards
Author :
Yue-Hui Huang ; Mu-Shui Zhang ; Hong-Zhou Tan
Author_Institution :
Dept. of Electron. & Commun. Eng., Sun Yat-sen Univ., Guangzhou, China
Abstract :
In this paper, we studied the problem of IR drop of high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify the process and improve efficiency. It is found that both vias contact of voltage regulator module (VRM) and the copper planes produce significant IR drop. A novel method for IR drop reduction is proposed, which can significantly reduce the resistance introduced by vias contact of VRM and copper planes. This method can reduce IR drop by about 50%. Furthermore, we also discuss the IR drop reduction for multi-plane structures. With reasonable design rules, the IR drop of PCBs with current demand of 100+A can be kept within a few tens of millivolt.
Keywords :
printed circuit design; vias; IR-drop reduction; PCB; adaptive mesh; copper planes; high performance multilayer printed circuit boards; multiplane structures; vias contact; voltage regulator module; Arrays; Copper; Finite element analysis; Printed circuits; Resistance; Voltage control; IR drop; printed circuit board(PCB); resistance; through via; voltage regulator module(VRM);
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922723